Strategy and mechanics for bendable micro-light emitting diode array integrated by polymer

	Strategy and mechanics for bendable micro-light emitting diode array integrated by polymer
	Fang, S. W.; J. Q. Liang; Z. Z. Liang; Y. X. Qin; J. G. Lv and W. B. Wang
	2017
发表期刊	Microelectronic Engineering
卷号	179
摘要	The strategy for fabricating bendable micro-light emitting diode arrays is presented and the mechanical properties of bent arrays are analysed in this paper. The key procedures of the fabrication process consist of grooving the wafer, welding the upside electrode with an indium tin oxide current-spreading layer, integrating the micro pixels, removing the substrate, electroplating the backside electrode, and encapsulating the device. In order to prevent potential physical destruction and improve the reliability and fatigue of the arrays, the position of the neutral mechanical plane was calculated. Strain and stress distributions in bent LED arrays showed that strain concentrated in the polymers and the generated stress preferentially concentrated in the electrodes and semiconductor. These results indicate that physical destruction, rupture, or delamination may first occur in the electrodes or semiconductor interface. (C) 2017 Elsevier B.V. All rights reserved.
收录类别	sci ; ei
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/58895
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Fang, S. W.,J. Q. Liang,Z. Z. Liang,et al. Strategy and mechanics for bendable micro-light emitting diode array integrated by polymer[J]. Microelectronic Engineering,2017,179.
APA	Fang, S. W.,J. Q. Liang,Z. Z. Liang,Y. X. Qin,&J. G. Lv and W. B. Wang.(2017).Strategy and mechanics for bendable micro-light emitting diode array integrated by polymer.Microelectronic Engineering,179.
MLA	Fang, S. W.,et al."Strategy and mechanics for bendable micro-light emitting diode array integrated by polymer".Microelectronic Engineering 179(2017).

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